Electrodeposition of Al-Ni Alloys and Al/Ni Multilayer Structures

Tech ID: 15A033

Competitive Advantages

  •     Provides an economical alternative to fabricate Al alloys and multilayer structures
  •     Highly scalable compared to other techniques
  •     Easily control of the composition and phase of deposition

Summary

USF inventors have demonstrated, for the first time, a feasible and cost-effective alternative method to fabricate Al alloys and multilayer structures by electrodeposition in non-aqueous room-temperature ionic liquids. Specifically, they have identified a method of dissolving NiCl2 in 1-Ethyl-3-methyl Imidazolium Chloride/Aluminum Chloride electrolyte to provide good conductivity, low vapor pressure, and a wide electrochemical window; all of which are limited in current conventional practices. 

Different Parameters Deposited to Study the Effect of Deposition Potentials, Duty Ratios, and Frequencies on Alloy Composition 

Desired Partnerships

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  • Sponsored Research
  • Co-Development

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