3D Printable High-k, low-loss ceramic-thermoplastic composites with tailored properties for high power RF device applications

Tech ID: 19B127

Competitive Advantages

  •     3D printed
  •     Increased permittivity values
  •     Decreases coefficient of thermal expansion
  •     Better device performance in humid environments

Summary

Our researchers have developed an approach to develop high-k and low-loss polymer-ceramic composites by further modifying the new processes with introducing surface modification of sintered ceramic powders before the mixing process. This new process decreases coefficient of thermal expansion of the composite materials, while it also increases operating temperature and power range of the printed devices and modules. In addition, the properties of the composites can be tailored to match what the specific chip needs to lower the risk of potential device failures.   

Printed Sheets and Cylinders

Desired Partnerships

  • License
  • Sponsored Research
  • Co-Development

Technology Transfer
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